Call for Papers (Flexible and Wearable Electronics: from Materials to Applications)

  • Share:

A Special Issue on

“Flexible and Wearable Electronics: from Materials to Applications”


Electronic systems that can cover large areas on flexible substrates have received increasing attention in the last couple of decades because they enable classes of applications that lie outside those easily addressed with wafer-based electronics. Examples include flexible displays, electronic textiles, sensory skins, active antennas, etc. The field expends very fast and great developments have been obtained during the fast several years. Recent exciting progresses such as highly flexible/stretchable E-skins, large area flexible displays, highly sensitive sensors, wearable electronic devices suggest that there are still a lot of room needs to be exploited including materials, devices and systems.

This special issue is focused entirely on recent development in all topics related to flexible and wearable electronics. We will accept both experimental and theoretical works. We invite submission of original research articles/communications and comprehensive review papers to this special issue on the following related topics: the synthesis, fundamental studies of materials for flexible electronics, and their diverse flexible applications. The topics to be covered in this special issue include, but are not limited to:

l Synthesis, characterizations and mechanism understanding of materials for flexible electronics

l Nanofabrication and processing of flexible semiconducting materials;

l Materials, devices and systems for wearable electronics;

l Assembly and integration of flexible devices;

l Applicationsin flexible LEDs, displays, sensors, solar cells, batteries, photo catalysts, etc;


Prof. Guozhen Shen, State Key Laboratory for Superlattices and Microstructures, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China. E-mail: Group website:

Prof. Yongfeng Mei, Department of Materials Science, Fudan University, Shanghai 200433, China. E-mail: Group website:

Prof. Chuan Wang, College of Engineering, Michigan State University, East Lansing MI 48824, USA. E-mail:; Group Website:

Prof. Taeyoon Lee, School of Electrical and Electronic Engineering, Yonsei University, South Korea. E-mail:, Group Website:

Manuscript Submission:

Manuscripts much be prepared according to Journal’s guidelines, available at

Submit your manuscripts directly to the listing guest editors via thee-mail addresses above. Or directly submit via the online submission address at

Please notify well in advance for your intension to submit a research paper.

Key timetable dates:

Manuscript due: July 31, 2017

Authors’ notification: August 31, 2017

Publication date: October 31, 2017